Jiangmen PCB explains PCB production process

2020-04-28 10:57:02

  1、 Contact the manufacturer

  First contact the manufacturer, then register the customer number, then someone will quote for you, place an order, and follow up the production progress.

  2、 Open material

  Intention: according to the requirements of engineering material MI, on the large sheet that meets the requirements, cut into small pieces to produce the sheet. Small pieces that meet the requirements of customers

  Process: large plate → cutting plate according to MI requirements → curizing plate → fillet grinding → plate exit

  3、 Drilling

  Intention: according to the engineering materials, drill the required hole diameter in the corresponding direction on the plate with the required size

  Process: laminated pin → upper plate → drilling → lower plate → check and repair

  4、 Copper sink

  Intention: copper deposition is to deposit a thin layer of copper on the insulating hole wall by chemical method

  Process: rough grinding → hanging plate → automatic copper sinking line → lowering plate → soaking% dilute H2SO4 → thickening copper

  5、 Figure handling

  Intention: Graphic handling is to transport the image on the production film to the board

  Process: (blue oil process): grinding plate → printing the first side → drying → printing the second side → drying → exploding → developing → viewing; (dry film process): Hemp plate → pressing film → standing → alignment → exposure → standing → developing → viewing

  6、 Graphic plating

  Intention: pattern plating is to electroplate a layer of copper layer and gold nickel or tin layer of required thickness on the copper skin or hole wall exposed by the pattern of the circuit

  Process: upper plate → degreasing → water washing twice → micro etching → water washing → acid pickling → copper plating → water washing → acid pickling → tin plating → water washing → lower plate

  7、 Retrogressive membrane

  Intention: use NaOH solution to remove the anti - plating coating and expose the non - circuit copper layer

  Process: water film: inserting frame → alkali soaking → scouring → scrubbing → passing machine; dry film: placing plate → passing machine

  8、 Etching

  Intention: etching is to use chemical reaction to remove copper layer from non circuit parts

  9、 Green oil

  Intention: green oil is to transport the green oil film graphics to the board, which plays a role in maintaining the circuit and blocking the tin on the circuit when welding parts

  Process: grinding plate → printing photosensitive green oil → curium plate → exposure → developing; grinding plate → printing the first side → baking plate → printing the second side → baking plate

  10、 Character

  Intention: a character is a recognizable symbol provided

  Process: after green oil finishing curium → cooling and standing → screen adjustment → character printing → rear curium

  11、 Gilded finger

  Purpose: the plug finger is plated with a nickel gold layer of required thickness to make it more hard and wear-resistant

  Process: plate loading → degreasing → water washing twice → micro etching → water washing twice → acid pickling → copper plating → water washing → nickel plating → water washing → gold plating

  Tinplate (a parallel process)

  Intention: Tin spray is to spray a layer of lead tin on the exposed copper surface without covering up the solder resist oil, so as to maintain the copper surface from corrosion and oxidation and ensure good welding performance

  Process: Micro etching → air drying → preheating → rosin coating → solder coating → hot air leveling → air cooling → washing and air drying

  12、 Forming

  Intention: through die stamping or CNC gongs and gongs, we can get the shape that customers need organic gongs, beer boards, gongs and hand cutting

  Note: the accuracy of data gong machine board and beer board is higher, gongs second, hand cutting board can only make some simple shapes

  13、 Test

  Intention: through 100% electronic test, detect open circuit, short circuit and other defects affecting functionality that are not easy to find by visual inspection

  Process: upper mold → place plate → test → pass → FQC visual inspection → fail → repair → retest → OK → rej → void

  14、 Final examination

  Intention: through 100% visual inspection of the appearance defects of the board, and repair the minor defects, to prevent problems and defective board outflow

  Specific workflow: incoming material → view material → visual inspection → qualified → FQA spot check → qualified → packaging → unqualified → handling → check OK

   Jiangmen printed circuit board http://www.fartai.com/


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